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Feaures:
Lead-free, halogen-free, non-resistive and non-conductive.
It is suitable for PCB, BGA, CSP packaging, welding and repairing of electronic products.
It has good activity and stable performance without adding halogen.
The solvent added in the product is organic acid, resin, moderate viscosity, good rheological property and good tin dipping effect.
Pacakge Included:
1 x BST-559A 30g Insulation Soldering Paste Flux
Please note it will need about 12~20days for the delivery!
Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers control.
Thank you for your understanding!
Change of Mind Policy: We 100% support our customers, If you are not satisfied, you may return any item within 30 days of delivery. If the product is no problem, all shipping charges must be paid by customer for returns. If you have any problem with our products, please CONTACT US at once.
GTIN: 5202984901570
Estimated Delivery Time Frame:12-20 business days
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Reference ID: 2684274
