Description :

 XG-40 10CC BGA Solder Flux Paste Soldering Tin Cream Sn63/Pb37 25-45um

New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
More advanced insulation technology, tack lasting, easy to change to dry, the viscous time up to 48 hours or more.
High-end quality with unique formula, perfect performance, easy to weld, solder joint is bright and full, no Weld, false welding phenomenon.

The residue is colorless and transparent, does not affect the detection.
Anti-dry, relatively long shelf life at room temperature, adapted to the mobile phone repair industry, the computer digital service industry, high-precision circuit board SMT soldering, BGA welding process, and so on!
Unique high-quality solder paste (the best configuration Ingredients: Sn63/Pb37), fine and flexible packaging (10 cc / support).

Alloy : Sn63/Pb37
Microns : 25-45um
Net : 10CC
 

Package includes : 

1x XG-40 10CC BGA Solder Flux Paste